ORLANDO, FL – The Skyway Organization (“Skyway”) announced today that it participated in the 2026 Florida Semiconductor Summit Innovation Pitch Competition, presenting its next-generation carbon nanotube (CNT) film platform designed for extreme ultraviolet (EUV) lithography pellicle applications.
Skyway’s CNT film technology, developed under its proprietary TitanFlow™ advanced materials platform, targets one of the most critical bottlenecks in advanced semiconductor manufacturing: durable, high-transmittance EUV pellicles capable of surviving high-power EUV exposure while maintaining dimensional stability and ultra-low defect density.
Addressing the EUV Pellicle Challenge
EUV lithography systems—such as those deployed by leading chip manufacturers for sub-5nm and next-generation nodes—require pellicles that:
- Withstand >600W to 1000W+ high-power EUV exposure
- Maintain high EUV transmittance (~95%+)
- Exhibit exceptional thermal conductivity
- Resist deformation and particle-induced defect amplification
- Maintain nanometer-scale flatness over large apertures
Current pellicle materials face trade-offs between transparency, mechanical robustness, and thermal resilience. Skyway’s CNT film architecture aims to break that constraint curve.
TitanFlow™ CNT Films: A Dual-Asset Breakthrough
Skyway’s approach leverages its TitanFlow™ reactor process and binderless CNT production system, producing:
- High-purity, tunable CNT films
- Controlled morphology and alignment
- Ultra-thin, mechanically resilient membranes
- High in-plane thermal conductivity
- Potentially scalable roll-to-roll compatible formats
Unlike conventional composite membranes, Skyway’s CNT films are engineered for binder-free structural integrity, minimizing absorption losses and contamination risks critical for EUV environments.
“We are targeting a fundamental materials bottleneck in EUV lithography,” said Joseph Tapley, Co-Founder & CTO of The Skyway Organization. “CNT films offer a rare combination of mechanical strength, thermal conductivity, and tunable optical properties. Through TitanFlow™, we can engineer films specifically optimized for pellicle survivability at extreme EUV power densities.”
Strategic Importance to Florida’s Semiconductor Ecosystem
Florida’s semiconductor and advanced manufacturing ecosystem continues to expand across aerospace, defense, photonics, and microelectronics domains. Skyway’s participation in the Innovation Pitch Competition underscores:
- Commitment to strengthening Florida’s advanced materials supply chain
- Development of domestic, dual-use semiconductor-enabling technologies
- Alignment with national security priorities in advanced node manufacturing
- Expansion of high-value materials manufacturing in-state
Skyway is currently advancing partnerships across research institutions and semiconductor stakeholders to validate CNT film performance under simulated EUV load conditions.
Dual-Use and National Security Implications
EUV lithography remains a strategically sensitive domain critical to leading-edge semiconductor fabrication. High-performance pellicle materials are essential to:
- Yield stability in high-volume manufacturing
- Protection of photomasks from particle contamination
- Enablement of next-generation logic and memory nodes
- U.S. semiconductor competitiveness and supply chain resilience
Skyway’s CNT film platform is positioned as a dual-use advanced materials solution with applications spanning semiconductor manufacturing, aerospace thermal management, photonics, and high-performance membranes.
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About The Skyway Organization
The Skyway Organization is an advanced materials and aerospace systems company developing breakthrough technologies across three integrated IP stacks:
- TitanFlow™ – Advanced CNT reactor and materials platform
- HYDRA™ – Dual-use multi-mode orbital craft architecture
- SARA™ – AI-enabled digital engineering and R&D platform
Through vertically integrated advanced materials innovation, Skyway is building enabling infrastructure for next-generation aerospace, semiconductor, and defense ecosystems.
Media Contact:
[email protected]
Innovation Pitch Session:
2026 Florida Semiconductor Summit
Innovation Competition Track
February 23–25, 2026 | Rosen Shingle Creek, Orlando, FL